Reference specifications
- Handling architecture
- Multi-station turret with simultaneous pick, placement and vision compensation
- Bonding pressure control
- Closed-loop
- Available option
- Frame heating
Final configuration is subject to Feixing’s quotation.
Download specification sheetPDF
Exploded illustrationInteractive structure and process
Structural illustration
Component details
Select a component to see what it does.
Operating sequence
A vacuum collet lowers to pick a die from the wafer stage.
Pass/Fail Checks for a Die Bonder Factory Acceptance Test
A buyer's guide to defining measurable pass or fail checks for a semiconductor die bonder factory acceptance test, covering turret handling, closed-loop bonding pressure, and frame heating.
Die Bonder Demos: Test With Your Own Dies
A buyer's guide to requiring a die bonder demonstration with the buyer's actual semiconductor dies, covering turret handling, closed-loop bonding pressure, and frame heating checks.
What to check at your site before machinery arrives
Confirm packed dimensions, unloading arrangements, installation space, and utility connections.
