Packaging & Testing
Semiconductor Die Bonder
Assembly
Interactive structure and processOperation simulation video
Equipment topics
Application
Assembly
Material
- Semiconductor Dies
Reference specifications
Download specification sheet- Handling architecture
- Multi-station turret with simultaneous pick, placement and vision compensation
- Bonding pressure control
- Closed-loop
- Available option
- Frame heating
Final configuration is subject to Feixing’s quotation.
Interactive structure and process
- Pick an individual die
- Index past vision alignment
- Place and bond the die
Need a specific configuration?
Send the material, dimensions and output you need so we can prepare an equipment quote.
News
NewsPass/Fail Checks for a Die Bonder Factory Acceptance Test
A buyer's guide to defining measurable pass or fail checks for a semiconductor die bonder factory acceptance test, covering turret handling, closed-loop bonding pressure, and frame heating.
Die Bonder Demos: Test With Your Own Dies
A buyer's guide to requiring a die bonder demonstration with the buyer's actual semiconductor dies, covering turret handling, closed-loop bonding pressure, and frame heating checks.
What to check at your site before machinery arrives
Confirm packed dimensions, unloading arrangements, installation space, and utility connections.